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硫酸铜溶液(电镀用)
硫酸铜溶液(电镀用)Copper Sulfate Solution, for electroplating
硫酸铜溶液(电镀用) Copper Sulfate Solution, for electroplating |
规格 Specifications |
五水合硫酸铜晶体 (CuSO4·5H2O) |
295~305 g/L |
铜 (Cu) |
≥ 75 g/L |
锰 (Mn) |
≤ 5 mg/L |
铁 (Fe) |
≤ 4 mg/L |
锌 (Zn) |
≤ 4 mg/L |
氯 (Cl) |
≤ 4 mg/L |
铅 (Pb) |
≤ 3 mg/L |
钙 (Ca) |
≤ 2 mg/L |
镍 (Ni) |
≤ 2 mg/L |
砷 (As) |
≤ 2 mg/L |
密度, 25摄氏度 (Density at 25℃) |
1.17~1.19 g/mL |
pH值, 25摄氏度 (pH value at 25℃) |
1.50~2.50 |
应用领域:
电子元器件,化学沉铜,PCB/FPC等。
Applications:
Electronic devices, Electroless Copper Deposition, PCB/FPC etc.
包装规格:
20 升/桶;
200升/桶
Package:
20 L/BARREL;
200 L/BARREL
储存说明:
在原包装桶中,18摄氏度以上贮存期大于2年。
Storage instruction:
If stored properly above 18℃ and in its original barrel, it has an indefinite shelf life.